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The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has become very popular because of their numerous advantages. The ACA process can be used in high-density applications and with various substrates as the bonding temperature is lower than that in the soldering process. In this paper, six test lots were assembled using two anisotropic conductive adhesive films...
Recently, wafer level package (WLP) has become one of the promising packaging technologies due to its advantages such as fewer processing steps, lower cost, and enhanced device performance compared to single chip packages. Many developments on new WLP design, materials and processes have been accomplished according to the electrical, mechanical performance and reliability requirement of the devices...
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