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This paper presents an innovative structure based on 3 dimensional integration technology, where ultra thin inter layer dielectric enables a dynamic threshold voltage (VTH) control. A sequential process flow is proposed to fabricate 3D devices with dynamically tunable VTH. This ability can be exploited to design SRAMs cells with increased stability and surface density compared to planar technology...
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
The next generation of wireless communication is a ubiquitous radio system concept, providing wireless access from short-range to wide-area, with one single reconfigurable and adaptive system for all envisaged radio environments. This paper presents the design approach of RCO (reconfigurable concurrent oscillator) that simultaneously generates two or more signals of different frequencies that eliminate...
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