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The deformation of core board affects the quality of circuit board, like misalignment, during lamination process of MLB (Multilayer Board). Three main factors causing the deformation are discussed, which are the mismatch of CTE (Coefficient of Thermal Expansion) among different materials, the residual stress in core boards and the special properties of the prepreg. Considering properties changing...
Full density nanocrystalline (NC) Cu with average grain size of 33 nm was prepared through high energy ball milling. Effects of annealing on microhardness and activation volumes (V*) were studied. The magnitude observed for these characteristic deformation parameters is very different from their course-grained (cg) counterpart. The much higher micro-hardness of as-prepared Cu sample of 1.7 GPa was...
The next European dipole (NED) activity is aimed at the development of a large-aperture, high-field superconducting magnet relying on high-performances Nb3Sn conductors. Part of the NED program is devoted to the mechanical study of a new generation of Nb3Sn wires and to predict and describe their behavior under the severe loading conditions of the cabling process. The deformation resulting from the...
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