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This paper presents results from an investigation into the optimal design of an open-slot, modular stator winding. The impact of the stator slot shape on the winding temperature rise is explored, taking account the distribution of loss that occurs in the open slot winding, including ac effects, and the heat transfer characteristics from the winding assembly into the stator core pack. The application...
We report on the thermal analysis of high-power LED arrays used for solid state lighting (SSL). Variety of assemblies using high-power LED chips, were considered along with different heat-sink designs. Chip-on-plate (COP) packaging technique was used for all the LED chips attached to variety of heat-sinks. The 3D modeling and simulations were carried out to study the thermal behavior of LED chips...
We present a method of dynamic thermal characterization of an entire test assembly, consisting of high-power Light Emitting Diodes (LED) and a printed circuit board (PCB) by measuring the thermal response on a power-on-step function and describing the thermal impedance with a Foster RC network. For this purpose, we record temporal temperature functions on test assemblies during pulse load experiments...
Fabrication processes, like die attachment or plastic encapsulation, lead to thermal stresses in micro-assemblies due to CTE mismatches of the involved materials. In this paper, stress- and strain-sensitive test chips were used to measure in situ absolute stresses caused by die attach and encapsulation processes. Furthermore, deformations of assemblies over temperature were observed by white light...
The package technology has matured significantly over the past several years, shifting from conventional components and direct board level assembly to chip or package level system integration. Two major commonly used approaches are System-on-Chip (SoC) and System-in-Package (SiP). Package-on-Package (PoP) that integrates logic die in the bottom package and memory die in the top package into a single...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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