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In recent years, through wafer electrical connections have become important roles, which will be used in developing high-speed, compact 3D microelectronic devices in next generation. Although the electroplating copper is a well-established process, completely void-free electroplating in through silicon holes (TSH) with a high aspect ratio remains a big challenge. Naturally, local current distribution...
Electroplating technology for via filling with copper for three-dimensional packaging is one of the strong candidates. The Cu electroplating technology for perfect via filling is discussed in this paper. A plating solution was prepared, in which plating deposition potential was found to be influential on its solution flow rate. The characteristics of organic additives in the plating solution were...
One reliability concern, when soldering to a Cu surface finish, is the sporadic mechanical degradation of solder joints due to the formation and growth of voids within the interfacial Cu3Sn intermetallic compound (IMC) layer and at its interface with the Cu pad structure. Excess organic impurity incorporation during Cu electroplating has been shown to cause this problem. The level of impurity incorporation...
Embedded capacitor technology is an essential method for miniaturization and high performance of electronic package systems. High dielectric constant epoxy/ceramic composites have been of great interest as embedded capacitor materials because they have good processability, compatibility with printed wiring boards (PWB), and high dielectric constant. In previous works, epoxy/BaTiO3 composite embedded...
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