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This paper describes the feasibility of a low-temperature diffusion bonding process for Cu thin film electrodes in ambient air. After Cu thin film surfaces were bombarded by an Ar fast atom beam in vacuum to remove the initial thick adsorbate layer, the surfaces were contacted with each other at atmospheric pressure. As the exposure condition, O2 gas with controlled humidity was used to prevent moisture-induced...
This paper discloses a novel, high accuracy and low cost integration method based on an electrochemcial pattern replication (ECPR) technology for multi-level stacking applications such as integrated passives, multi-level redistribution layers and top level IC interconnect structures. It is demonstrated how a first copper layer is coated with BCB (bisbenzocyclobutene), which is planarized with CMP...
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