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Warpage of semiconductor packaging substrate during or after manufacturing processes has been a serious issue in the electronics industry. We found that the packaging substrate, which has initial warpage at room temperature, changes its warpage orientation by flipping from a concave to a convex cylindrical shape during the thermal processing. In this paper, we demonstrate that the rotation of warpage...
Thermal stresses in Flip Chip Ball Grid Array (FCBGA) generated by the Chip Package Interaction (CPI) while cooling during the reflow process were calculated using Finite Element Analysis (FEA). This paper is focused on the thermal stresses in Cu/low-k on-chip interconnect where the non-uniform temperature distribution is considered. The temperature distribution was first calculated by FEA using the...
Amkor's FCMBGA, flip chip package based on transfer molding for high performance device was developed and introduced to industry in 2008[1,2]. During the molding process, bump deformation was not significant, and voids were not observed under flip chip die. Coplanarity with a low coefficient of thermal expansion, CCTETE, substrate construction was similar to a single piece lidded package construction...
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