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This paper discusses challenges, design issues and possible solutions to get mm-Wave signals off-chip. Simulationand measurement results are discussed for three mm-Wave designs at different frequencies in bulk CMOS technology. (1) The design of a back-to-back IC-to-board interconnect using wire-bonding and microstrip lines is described to package and measure the chips without the need for a mm-Wave...
We have explained the effect of the silicon substrate on the off-chip radiation of an integrated antenna on chip. From this consideration a low-cost approach for an enhanced antenna-on-chip design has been derived and its improved radiation efficiency has been confirmed by measurements.
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