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In this paper, we introduce and study the Rectangle Escape Problem (REP), which is motivated by PCB bus escape routing. Given a rectangular region R and a set S of rectangles within R, the REP is to choose a direction for each rectangle to escape to the boundary of R, such that the resultant maximum density over R is minimized. We prove that the REP is NP-Complete, and show that it can be formulated...
The flip-chip package provides a high chip-density solution to the demand for more input-output pads of very large scale integration designs. In this paper, we present the first routing algorithm in the literature for the preassignment flip-chip routing problem with a predefined netlist among pads and wire-width and signal-skew considerations. Our algorithm is based on integer linear programming (ILP)...
Nanometer effects have complicated the designs of chips as well as packages and printed circuit boards (PCBpsilas). In order to improve the performance, convergence, and signal integrity of the design, chip-package-board co-design is strongly recommended by industry. In this paper, we present the first routing algorithm in the literature for chip-package-board co-design with differential-pair considerations...
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