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We present a novel wafer-level-chip-size-package (WLCSP) technique with inverted microstrip line (IMSL) for mm-wave Si-CMOS ICs. The IMSL consists of a signal transmission line formed as a part of the CMOS processing and Cu-plated ground plane, where thick low-k PBO (poly-benzoxazole) is formed between them. The chip can be flip-chip bonded onto the circuit board, and the RF performance is not affected...
This paper presents low loss CPW (Co-Planar Waveguide) and microstrip via transitions on LCP (Liquid Crystal Polymer) substrate. The CPW transition using 105 mum via holes on a 4 mil LCP shows virtually no loss up to 25 GHz and about 0.13 dB of loss per transition at 40 GHz. The microstrip transition has no loss up to 15 GHz and approximately 0.5 dB of loss per transition at 30 GHz. In addition, the...
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