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Lighting purpose organic light-emitting devices have to be answer to high electrical and thermal requirements. Design of these devices needs special engineering. The electrical current and dissipated power distribution in an OLED needs electro-thermal field simulation. The algorithm in our simulation tool, SUNRED, had to be extended to be able to handle highly nonlinear electrical OLED characteristics,...
The development of power supply technology has always been associated with the need for further miniaturization. This means that power semiconductors must be mounted at short distances on the same heat sink. Adjacent power semiconductors have an increasing influence on the chip temperature. The maximum junction temperatures, which are specified by the manufacturer under all operating conditions, may...
Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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