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Heat generated in microelectronic devices as a result of dissipated power is a major issue in power electronics applications resulting in elevated application PC board temperatures. In order to minimize the down ward heat transfer to the application board an efficient method enabling the upward flow of heat from the silicon die to the top of the microelectronic package and subsequently transferred...
Consideration of health management and reliability form an integral part of the design and development cycle of electronic products. In this paper real-time compact thermal models are employed as an efficient tool to monitor thermal path degradation at particular locations within the module such as interfaces between the base-plate and heatsink. The compact real-tine thermal model is used to predict...
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