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The thermal finite element model of the power module based on the actual physical conditions is not easy to be consistent with the experimental results, limited by the accuracy of the input conditions. In this paper, a method of calibrating the transient thermal finite element model using the measured thermal structural function is proposed and practiced. The structural functions derived from the...
The lifetime of LED luminaires, made of high power LED arrays, operating under hostile conditions is determined by their thermal design, operating junction temperature and thermal transients managed by the thermal system. Thermal transient characterization is a noninvasive study of the thermal resistance characteristics or thermal design of the LED luminaire. This procedure can identify anomalies...
The junction temperature of an light emitting diode package (LED) is a parameter of consequence as electrical and optical characteristics of the packages progressive decline with increment in the junction temperature. This paper is to compare the temperature rise in p-n junction of a four-chip cool white high power light emitting diode (HPLED) by using thermal transient tester (T3ster) and thermal...
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