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A fixture was designed and built to test power cycling reliability at maximum junction temperatures of 150°C and 175°C. A 1200V, 150A IGBT six pack module was mounted on a single cold plate and three sets of cold plates were connected to DC power supplies controlled by LabView. The IGBTs on each cold plate were cycled to give a junction-to-case temperature rise of 100°C with a maximum junction temperature...
In order to meet the through-life reliability targets for power modules, it is critical to understand the response of typical wear-out mechanisms, for example wire-bond lifting and solder degradation, to in-service environmental and load-induced thermal cycling. Application of accurate wear-out models can identify the dominant failure mechanisms at the design stage and can be employed in reliability...
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