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A gold coated silicon mirror (5mm × 5mm) actuated by 1×10 piezoelectric Pb(Zr, Ti)O3 (PZT) array actuator integrated on a cantilever beam has been demonstrated for variable optical attenuator (VOA) application. Torsional attenuation based on the difference in the dc biasing voltage applied to the 1×10 PZT array actuator was investigated. The dynamic attenuation range of 40dB at 1.8V DC bias is observed...
In this paper we study the impact of two sacrificial layers on the final residual stress of thin gold films. In particular, we compare a typical photoresist layer (Shipley SC1827) to single-crystalline silicon. We fabricate and measure cantilever beams on both sacrificial layers and study their residual stresses by analyzing the final displacement profile of the released beams. All samples were fabricated...
Microelectrodes are becoming an important tool for sensing of neuro-chemical and neuro-electrical signals for studying neural activities. Although a lot of work has been done for the development of microelectrodes made up of different materials, such as metal micro-wires, ceramic oxide, polymers, carbon fiber microelectrodes and silicon but these are still far from being satisfactory. An ideal material...
A wafer-level bonding technique for hermetic, near-hermetic & vacuum packaging of MEMS is proposed. Silicon wafers are metallized with an intermediate layer of gold on which a low temperature solder such as Pb37/Sn63 having a thickness of 50-100 mum is deposited. The bonding layer is deposited either by screen printing or eutectic preforms. Two identical wafers are aligned at the intermediate...
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