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IC performance is now predominantly governed by interconnects delay due to smaller wire cross-section, wire pitch and longer lines that traverse across larger chips. These increase the resistance and capacitance hence signal latency of these lines. Material solutions such as Cu/low-kappa is no longer able to reduce interconnects delay time as pitch is scaled down further. 3-D ICs with multiple active...
A systematic study of electrical and magnetic transport properties of FexAg100-x (50<x<55)thin films deposited by both sputtering and pulsed laser ablation onto two p-type Si substrates with different resistivities is reported in this work. Resistance, magnetoresistance and Hall effect were measured in the temperature range 75-350 K. Magnetization was measured in the temperature range 5-300...
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