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A novel fast algorithm for accurate broadband electromagnetic analysis of 3-D passives embedded in multilayered media is presented. The electromagnetic boundary-value-problem for the interconnect layout embedded in silicon substrates is formulated in terms of Michalski-Zhang's formulation C for the Mixed-Potential-Integral-Equation (MPIE). The MPIE is discretized using the Rao-Wilton-Glisson (RWG)...
Coplanar waveguide transmission lines and vertical interconnects are implemented on a thick (15 mum) Parylene-N dielectric layer over a lossy CMOS-grade Si substrate. Devices are measured up to 40 GHz and show very low loss behavior. Low loss tangent and low dielectric constant characteristics of Parylene-N result in significant improvement of transmission lines and interconnects compared to those...
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