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The multi-stack processes for wafer-on-wafer (WOW) have been developed. The key features are bumpless interconnects adapted to TSVs and extendibility for chip-on-wafer (COW) taking high throughput into account. In order to realize the multi-stacked wafers with ultra thinned wafer of less than 10μm with an adhesive polymer, several processes have been optimized. The thickness of the wafer after back-grinding...
A diaphragm-type optical fiber pressure sensor, which has a sleeve for fiber insertion, is proposed, and its fundamental characteristics are demonstrated. The sleeve structure is fabricated by deep reactive ion etching (DRIE). The diaphragm with the sleeve is suitable for highly reliable and easy bonding between the sleeve and an optical fiber. The light intensity change by a Fabry-Perot interferometer...
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