The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Wafer-bonding-based integration can be rapidly and easily tested between different types of devices by wafer-to-wafer flip-chip transfer technology described in this paper. Devices to be tested (e.g. MEMS) on a support wafer are bonded and electrically connected with a target wafer (e.g. LSI) using sticky silicone bumps, and then any of the devices are selectively debonded from the support wafer by...
The direct integration of surface acoustic wave (SAW) devices on top of large-scale integrated circuits (LSI) will enable multiband wireless front-ends, one-chip wireless systems, high-performance one-chip oscillators etc. However, this has been difficult, because SAW devices are often fabricated on piezoelectric crystals with special cut angle, which have different coefficients of thermal expansion...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.