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Wafer-bonding-based integration can be rapidly and easily tested between different types of devices by wafer-to-wafer flip-chip transfer technology described in this paper. Devices to be tested (e.g. MEMS) on a support wafer are bonded and electrically connected with a target wafer (e.g. LSI) using sticky silicone bumps, and then any of the devices are selectively debonded from the support wafer by...
The direct integration of surface acoustic wave (SAW) devices on top of large-scale integrated circuits (LSI) will enable multiband wireless front-ends, one-chip wireless systems, high-performance one-chip oscillators etc. However, this has been difficult, because SAW devices are often fabricated on piezoelectric crystals with special cut angle, which have different coefficients of thermal expansion...
We demonstrate two types of three-dimensional (3D) integration using chip self-assembly techniques with liquid surface tension. In reconfigured wafer-to-wafer 3D integration, many different sizes of chips having In/Au microbumps with/without TSV (through-silicon via) were temporarily placed by self-assembly on a reconfigured wafer in a back-to-face manner. The many chips can be then simultaneously...
We have proposed the intelligent Si neural probe system which can realize high density and multifunctional recording of neuronal behaviors. In this device, LSI chips such as amplifiers, A/D converters, and multiplexers are integrated on the intelligent Si neural probe. In this paper, we report the development of a novel Si neural probe with microfluidic channels which is the key part of the intelligent...
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