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Wafer bonding is an attractive technology enabling manufacturing of complex wafer-level 3D architectures. The continuous demand for device size shrinking and performance improvement pushed for the development of new manufacturing technologies. This work reviews the main challenging raised for the wafer bonding processes and presents new developments in the aligned wafer bonding processes.
Advanced methods for low temperature bonding are reviewed and discussed in terms of the concept of the surface activation and the future outlook of their development in 3D integration. As one of the methods, a new attempt for room temperature bonding is introduced, which enables to bond inorganic materials such as Si oxides, glasses and sapphire as well as single crystalline piezoelectric materials...
A robust torque sensor with rapid response was constructed by forming magnetostrictive layers and mounting coils on a carbon steel shaft. A sensitive and reliable Fe40Ni56Cr4 magnetostrictive layer was formed using a low-pressure plasma spray method. A magnetic field perpendicular to the magnetostrictive layer plane is generated by a current flowing through the twin coils to magnetize the steel shaft...
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