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Wafer bonding is an attractive technology enabling manufacturing of complex wafer-level 3D architectures. The continuous demand for device size shrinking and performance improvement pushed for the development of new manufacturing technologies. This work reviews the main challenging raised for the wafer bonding processes and presents new developments in the aligned wafer bonding processes.
The novelty of this paper is the proof of functional microdevice fabrication using a recently developed low-temperature transfer process. The process is based on adhesion control of molded Ni microstructures on a donor wafer by using plasma-deposited fluorocarbon films. Low-temperature adhesive bonding of the microstructures on the target wafer using benzocyclobutene sealing enables mechanical tearing...
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