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Hybrid pixel detectors are now widely used in particle physics experiments and at synchrotron light sources. They have also stimulated growing interest in other fields and, in particular, in medical imaging. Through the continuous pursuit of miniaturization in CMOS it has been possible to increase the functionality per pixel while maintaining or even shrinking pixel dimensions. The main constraint...
Microscopy of 3D interconnect structures is challenged by the opaque nature of silicon. Infrared (IR) microscopy provides a way of “seeing” through the silicon where microscopes based on visible wavelengths fail. IR microscopy is used in 3D manufacturing to image sub-surface features (alignment fiducials, defects, and voids) at the interface of bonded wafers. This practical solution enables a variety...
This paper presents the implementation of a key technology developed for high density 3-D integration by circuit stacking. Direct copper bonding at room temperature, atmospheric pressure and ambient air of copper pads allowed the elaboration of a 10times10 mum vertical interconnect with a contact resistance of 10 mohms. First tests on tungsten bonding will be also reviewed.
A diaphragm-type optical fiber pressure sensor, which has a sleeve for fiber insertion, is proposed, and its fundamental characteristics are demonstrated. The sleeve structure is fabricated by deep reactive ion etching (DRIE). The diaphragm with the sleeve is suitable for highly reliable and easy bonding between the sleeve and an optical fiber. The light intensity change by a Fabry-Perot interferometer...
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