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Electroless Ni-P plating is cost effective process to fabricate UBM for solder flip chip. Thickness of electroless Ni-P UBM is important factor for mechanical and electromigration reliability. Pb-free solder flip chips with different UBM thicknesses of 3, 5 and 10 mum were prepared. First, the effect of UBM thickness on mechanical reliability was investigated. Before underfilling, flip chips using...
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