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This paper establishes parametric model of the bioprosthetic heart valve via computer aided design. Dynamic finite element analysis is used along with a geometrically accurate model of the bioprosthetic heart valve. The stress distribution of cylindrical and paraboloidal valve leaflets under the same load is analyzed as the leaflets are closed. The finite element analysis results show that the stress...
Advanced wafer technology node has moved forward to 40 nm and below with an ultra low-K (ULK) dielectric constant value of 2.5. ULK shows lower mechanical strength and poor adhesion than that of low-K dielectric. Cu/ULK delamination becomes the major concern during the packaging reliability test. After eliminating the Cu/low-K delamination issue, experimental result shows that die crack become another...
This paper considers mechanical stress and strain in a piezoresistive cantilever sensor under surface stress loading, which is the loading condition that occurs in biochemical sensing applications. Finite element simulations examine the piezoresistor sensitivity due to changes in cantilever length, width, and thickness, and piezoresistor size, location, and depth. A few unexpected results are found...
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