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This paper presents an experimental study of an accurate temperature-monitoring method using an embedded thin-film microsensor array for laser-assisted polymer bonding for MEMS packaging. The work is carried out using a fiber-coupled diode laser system and benzocyclobutene polymer as the bonding material. Beam-forming optical elements are used to generate top-hat and frame-shaped beam profiles. Platinum-based...
Microfluidic systems are being used in more and more areas and the demand for such systems is growing every day. Hence, a cheap and rapid method for sealing these microfluidic platforms which can be used for mass manufacture is needed. In this paper low frequency induction heating (LFIH) is presented as technique for the packaging of polymer based microfluidic systems. Thin metal layers serving as...
The study aims at developing a next-generation flip chip (FC) packaging technology that employs a novel anisotropic conductive adhesive (ACF) made of unidirectional Co-nanowire-reinforced polymer nanocomposite, and moreover, exploring the associated process-induced, thermal-mechanical behaviors during bonding process. For carrying out the process simulation, a process-dependent finite element modeling...
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