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Thermal spreaders have been of interest over the last few decades. Heat pipes, Thermal Pyrolytic Graphite (TPG), and other graphite-based materials have been commonly used for enhancing the thermal performance. This study will start for a discussion of Chemical Vapor Deposition (CVD) of diamond manufacturing to enable high conductivity plates for heat spreading. Later attention will be turned to absolute...
A multi-temperature-cycle wafer curvature experiment was performed in order to study the temperature dependent material properties of copper films. The specimen consists of 20μm copper film electrochemically deposited on a silicon wafer. Focused Ion Beam and Electron Back-Scatter Diffraction were used to characterize the microstructure of copper films. Wafer curvature (wafer bow) measurements were...
The stress relaxation behavior of copper thin films in electro-thermo-mechanical multiple fields has been studied by a developed wafer-curvature method. Experimental results reveal that the electromigration plays an important role in the relaxation process. At tensile stress state, coupled surface diffusion and grain boundary diffusion are the dominant mechanisms even at low temperature. In addition,...
The polycrystalline samples of BaSi2, SrSi2, and LaSi were prepared by spark plasma sintering (SPS). The electrical resistivity (rho) and Seebeck coefficient (S) were measured above room temperature. The S of BaSi2 was negative and the absolute values were rather high (-669 muVK-1 at 337 K). The S of SrSi2 was positive and the absolute values were lower (118 muVK-1 at 332 K) than those of BaSi2. For...
In this study, we fabricated in-plane thermoelectric micro-generators (4 mm times 4 mm) based on bismuth telluride thin films by using flash evaporation method. The thermoelectric properties of as-grown thin films are lower than those of bulk materials. Therefore the as-grown thin films were annealed in hydrogen at atmospheric pressure for 1 hour in a temperature range of 200 degC. to 400degC. By...
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