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The layout of power modules is one of the key points in power module design, especially for high power densities, where couplings are increased. Stray inductances cause various problems in switching devices and should be minimized at an early design stage to avoid later required countermeasures and redesign after the device prototype has been built. In this paper, using Ansys® Q3D® Extractor, electromagnetic...
This paper proposes a novel packaging method for insulated-gate bipolar transistor (IGBT) modules based on the concepts of P-cell and N-cell. The novel packaging reduces the stray inductance in the current commutation path in a phase-leg module and hence improves the switching behavior. A P-cell- and N-cell-based module and a conventional module are designed. Using finite-element-analysis-based Ansys...
Conventional 2 in 1 IGBT package with 62mm×150 mm suffers from imbalance of current distribution and switching loss due to the different effect of internal electromagnetic field on multiple IGBT chips connected in parallel. A novel DBC (Direct Bonding Copper) layout was proposed in this paper to reduce the parasitics and the electromagnetic coupling between control loop and main current path. And...
To keep stray inductance low is a basic requirement in package design of IGBT modules. Meanwhile, paralleling of several switches is unavoidable in modern power electronics to insure always increasing current levels. Current balance between paralleled chips is another concern. In this paper, a simple power module, several different types of IGBT chips are respectively associated to reach the classical...
This paper proposes a novel packaging method for power electronics modules based on the concepts of P-cell and N-cell. It can reduce the stray inductance in the current commutation path in a phase-leg module and hence improve the switching behavior. Two IGBT phase-leg modules, specifically a P-cell and N-cell based module and a conventional module are designed. Using Ansoft Q3D Extractor, electromagnetic...
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