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The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has become very popular because of their numerous advantages. The ACA process can be used in high-density applications and with various substrates as the bonding temperature is lower than that in the soldering process. In this paper, six test lots were assembled using two anisotropic conductive adhesive films...
The downsizing of transistor dimensions enabled in the future nanotechnologies will inevitably increase the number of faults in the complex ULSI chips. To maintain the production yield at acceptable level, several levels of protection mechanisms will have to be implemented to tolerate the permanent and transient faults occurring in the physical layers. In this paper, we study fault tolerance at the...
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