The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnection technology to achieve a low form factor with increasing die and substrate complexities. Moreover, very thin 3D integrated packages and 2.5D packages...
We report the results of heat transfer analysis of CoW (chip on wafer) process in which IC chips are bonded on a Si wafer by using thermal compression bonding (TCB). The throughput can be remarkably improved because a lot of chips can be pre bonded on a wafer by using non-conductive film (NCF) which is pre-applied adhesive and can be thermally pressed at a time. However, to realize this process, it...
This paper deals with three recent advances in the area of ACA materials and processing technologies, (1) wafer-level ACA, (2) ultrasonic ACA bonding, and (3) Solder ACAs. Patented idea of Wafer level package (WLP) ACA/NCA was introduced earlier as one of the promising ACA packaging technologies due to its advantages such as fewer processing steps, lower cost, and enhanced device performance compared...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.