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<?Pub Dtl?>Emerging wireless standards specify dozens of bands spanning several octaves, which need to be supported in form-factor and energy constrained mobile devices targeting ubiquitous connectivity. However, in current multi-band radio implementations, significant redundancy is still the norm in the RF frontend. This work introduces an improved architecture for multi-band, time-division...
A tunable and highly digital RF frontend for multi-band TDD radios is integrated in 45nm SOI CMOS. The PA absorbs the TX branch of the TX/RX switch with no added loss. Peak PA output power is 27.5±0.5dBm from 1.6 to 3.4GHz, with up to 30% total efficiency at 2V. For TDD LTE applications, better than −30dBc ACLR and −25dB EVM is measured with 16-QAM, 20MHz signals from 1.65 to 3.5GHz, with up to 16...
Due to the increase of required bandwidth, the newer generation of communication systems uses spectrum-efficient digital modulations that involve non-constant envelope RF signals. A technique that potentially can concurrently provide high efficiency and linearity is the Envelope Elimination and Restoration (EER) transmitter architecture which is based on the decomposition of the transmitted signal...
We report a compact 802.11b/g/n MIMO SoC with fully integrated transceiver, on-chip PMU including dc-dc converters, PHY, MAC, PCIe and a non-volatile memory. The transceiver includes on-chip PA, LNA and T/R switch. Fabricated in 90nm standard digital CMOS technology, this IC consumes 663/878mW (Rx/Tx 54Mbps) with an area of approx 33mm2. A peak saturated power of 24dBm is achieved at antenna.
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