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A chip-package co-design method is presented for high frequency mixed SoC. Based on the analysis of simulation result of package and chip, a RC circuit which is composed of resistor and capacitor is designed on chip to suppress the affect of Simultaneous Switch Noise(SSN). Consequently, chip-package co-simulation achieves a good agreement with measurement as the co-design method is used to predict...
Current mode (CM) scheme provides suitable alternative for the high speed on-chip interconnect signaling. This paper presents a energy-delay optimization methodology for the current-mode (CM) signaling scheme. Optimization for the CM circuits for on-chip interconnects requires a joint optimization of driver and receiver device sizes, as their parameters which affect the energy-delay performance depend...
The paper presents the design and implementation of input/output interface circuits, fully compatible with low-voltage differential signal (LVDS) standard. Due to the low voltage differential transmission technique, the low power consumption and high transmission speed are achieved at the same time. The transmitter is implemented by a closed-loop control circuit and an internal bandgap voltage reference,...
In this paper, the design of a compact planar bandpass filter above a defected ground plane is presented. The filter is designed as a combination of microstrip resonators and exploits the properties of a planar electromagnetic bandgap (EBG) structure patterned unto the ground plane of the printed circuit board material to provide a very wide stopband of up to 5 times the fundamental frequency. The...
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