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Through-silicon vias (TSVs) using benzocyclobutene (BCB)-liners as the insulator have the potential for reducing the TSV capacitances and the thermal expansion stresses. This paper reports the assessments of BCB-liner TSVs with respect to thermal and electrical properties. The $C$ –$V$ and $I$ –$V$ characteristics are measured at room temperature and at an elevated temperature as high as 125...
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