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In the first part, a novel design route for metal protection against corrosion was proposed, and a class of triazinedithiolsilane compounds was conceived as protector for copper. The protective capability of the polymeric nanofilm, fabricated by self-assembling one representative (abbreviated as TESPA) of triazinedithiolsilane compounds onto copper surface, has been investigated and evaluated by electrochemical...
A ~35nm thick CdS buffer layer has been wet-chemically deposited on a CuInS 2 thin layer solar cell absorber and subsequently removed through a stepwise HCl etch process. Sequential etching times of two and three seconds were initially performed to gradually remove the CdS top-layer and leave the CuInS 2 surface intact. After each step an investigation of the sample with X-ray photoelectron...
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