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Four metallization systems, WTi/Au, Ti/Pt/Au, Mo/Au and Nb/Au, have been examined for thermal reliability, solderability, wire bonding and adhesion on chemically vapor deposited diamond (CVDD). Thermal stability up to 600°C was determined by conductivity measurements and X-ray photoelectron spectroscopy depth profiles. WTi/Au was found to be the most thermally stable, exhibiting constant resistivity...
We have studied the adhesion of small gold particles prepared by vacuum evaporation onto a substrate of alumina γ. Thin films of γAl 2 O 3 are obtained by oxidation of polycrystalline aluminium strip in air at 600°C during 24 h. The gold films are observed by transmission electron microscopy in order to study the density and size of particles, as function of average deposition thickness...
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