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Power management techniques can be effective at extracting more performance and energy efficiency out of mature systems on chip (SoCs). For instance, the peak performance of microprocessors is often limited by worst case technology (Vmax), infrastructure (thermal/electrical), and microprocessor usage assumptions. Performance/watt of microprocessors also typically suffers from guard bands associated...
This paper describes a novel battery management system to accomplish all of the necessary functions to ensure the safe, reliable operation of lithium ion batteries. An interface circuit monitors each battery voltage and temperature. It includes a trickle charger that achieves cell balancing by active instead of passive means. A series loaded resonant converter with isolation, also known as an LLC...
Timing-error detection and recovery circuits are implemented in a 65 nm resilient circuit test-chip to eliminate the clock frequency guardband from dynamic supply voltage (VCC) and temperature variations as well as to exploit path-activation probabilities for maximizing throughput. Two error-detection sequential (EDS) circuits are introduced to preserve the timing-error detection capability of previous...
A high bandwidth critical path monitor (1 sample/ cycle at 4-5 GHz) capable of providing real-time timing margin information to a variable voltage/frequency scaling control loop is described. The critical path monitor tracks the critical path delay to within 1 FO2 inverter delay with a standard deviation less than 3 FO2 delays over process, voltage, temperature, and workload. The CPM is sensitive...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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