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A physics-based equivalent lumped-circuit model for on-chip symmetric intertwined transformer is presented in this paper. This model accurately predicts the skin effect and proximity effect of the primary and secondary coils inductors over a wide-frequency range using a ladder `4-element' structure, respectively. One transformer loop and two RC networks are used to model the substrate loss related...
This paper discusses general procedures for simulation, design optimization, measurement and modeling of accurate and scalable on-chip RF spiral inductors in standard foundry CMOS for industrial applications. Electro-magnetic (EM) solver is used to simulate and optimize design of a library of inductors with various dimensions and specifications aiming to provide accurate and scalable inductors for...
A comprehensive study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.4 GHz CMOS wireless local area network (WLAN) receiver. To construct the package electrical models, specific modeling dies are designed to help extract the equivalent-circuit elements from measured S-parameters for chip-package interconnects. Furthermore,...
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