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This paper presents an investigation into the integration of high current density inductors into a double side cooled sandwich power module package from the perspective of thermal management of the integrated inductors. The advantage of using this integration method with regards to using the converter thermal management system will be discussed in order to create a high speed optimised commutation...
We present a feasibility study of low-voltage drives based on double-side cooled power modules. A novel press-pack module was developed and an inverter was built up subsequently. The drive was benchmarked with a 400 kW AC industrial inverter. A significant increase of the current density and output power was achieved.
We have developed a thin, reliable, low-thermal-resistance LSI packaging technology by embedding a high-pin-count LSI chip into thin build-up layers supported by Cu plate. The embedded LSI chip is a microprocessor with approximately 1500 pads and a thickness of 50 μm, and it is completely laminated by the first build-up epoxy resin. The total package thickness is only 0.71 mm including a 0.5-mm-thick...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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