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The non-linear capabilities of artificial neural networks to model the dynamics of creep rupture and failure mechanisms are exploited to achieve failure forecasting in high performance energy systems. The proposed approach forecasts the time to rupture due to creep mechanism and consists of the library construction, the experimental data and measurements necessary for the training process, the measurements...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur in the material properties (stiffness and strength) and creep behavior of Sn-Ag-Cu (SAC) lead free solders...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur in the material properties (stiffness and strength) and creep behavior of Sn-Ag-Cu (SAC) lead free solders...
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC)...
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