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The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during elevated temperature aging were unexpectedly large and universally...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
Decreasing the length of thermoelectric (TE) module legs results in a significant increase in power density, both for cooling applications and electricity generation. However, this reduction also results in a significant increase of mechanical stress in the legs materials. Thus, it is important to implement an effective method to characterize the mechanical properties, such as mechanical spectroscopy,...
This paper discusses the correlation between soft magnetic properties and microscopic magnetic structure in Co-(0-6 at%) Fe-(7-10 at%) Ta-N nanocrystalline films. Increasing the Fe content improves the soft magnetic properties of the films by decreasing the local anisotropy fluctuation. The temperature dependence of the coercive force indicates that the decrease in the magnetocrystalline anisotropy...
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