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In this third paper of the series, physics-based models are used to develop insight into practical aspects of the electrical performance of via interconnects in the frequency range up to 20 GHz. It will be shown that with careful design of the via environment, the current return path can be controlled, which makes it possible to describe vias in terms of transmission line parameters in certain frequency...
A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.
With the rapid development of high-speed digital circuits and high-integration-chip technology, more high-speed signals need to be transferred in high-speed interconnection. However, high-speed signals will experience delay, reflection, attenuation and crosstalk during the transferring. The transmission characteristic of printed circuit board (PCB) is very important as PCB is the support for the whole...
In this paper, three different elliptical slot ultrawideband (UWB) antennas are presented. These antennas are proposed and designed with a standard printed circuit board (PCB) process to be suitable for integration with radio-frequency/microwave circuitry. The first design is composed of half circular ring radiator element while the other design uses half elliptical ring shaped radiator. The shape...
This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System...
Accurate extraction of the parasitic parameters on a printed circuit board (PCB) and establishment of a new design method for high-power density by considering the parasitic components will become major technological issues to increase the power density of converters. This study focuses on the time domain reflectometry (TDR) technique for the effective measurement of parasitic parameters on PCBs with...
In the realm of high speed semiconductor IC testing, the medium whereby the test signals passed has important role in order to ensure that the signal transmitted and received are the correct signals. One of the media that the signal passed in IC testing is the device interface board or load board in short. Load board is basically a printed circuit board with test socket(s) for inserting device under...
This paper presents RF impedance analysis as a non-destructive indicator of interconnect failure mechanisms. Physical changes on a printed circuit board can be detected using the TDR reflection coefficient as a measure of RF impedance. The test circuit in this study consisted of an impedance-controlled circuit board, a surface mount low-pass filter, and two solder joints providing both mechanical...
This paper introduces a new type of pseudo-differential link in which the interconnection comprises a return conductor wider than the transmission conductors, whereas conventional pseudo-differential links use a common conductor similar to the transmission conductors. We explain the principle of this signaling scheme, referred to as the ZXnoise method, and the particular properties expected from the...
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