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A titanium tetrachloride (TiCl4) soak, which is a TiCl4 gas flow without any radio frequency power, was used prior to the use of plasma-enhanced chemical vapor deposition (PECVD) using TiCl4 at 450°C to form titanium and titanium nitride (Ti/TiN) as the contact-barrier films between nickel silicide (NiSi) and a tungsten plug. We found a 15% reduction in the contact resistance and its uniformity in...
This paper focuses on evaluating the adhesive strength of silver-tin (Ag-Sn) solder-jointed single-crystal silicon (SCS) specimens. The exothermic reaction in aluminum-nickel (Al/Ni) multilayer film was used as a heat source for melting the solder film. The reaction generated heat enough to melt Ag-Sn film. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point...
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