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This paper describes mounting of standard surface mount component packages on a paper substrate using an industrial solder process with a low-temperature solder. The use of paper as a substrate for printed flexible electronics is becoming more and more widespread as an alternative to the more commonly used plastic substrates, such as polyethylene and polyimide. Paper has the benefits of being environmentally...
Screen-printing is not a new technology in the printed circuit industry. However, the combinations of new paste materials and an advanced screen-printing process further increases the value of printable flexible electronics that cannot be made by the traditional photolithography process with copper foils. Additionally, more functionality from the circuits will be generated with new materials in the...
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