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In this paper, lumped models for vias in multilayered PCBs and their extraction are presented. Thereby, the model elements are derived from physics. It is possible to estimate the parameters of the lumped models using analytical formulas, but more precise values can be derived from vector network analyser measurements or 3d-field solver computations of a real via geometry. Two method for the extraction...
An intensity modulated fiber-optic position sensor, based on a fiber to bundle coupling and a readout system using a CMOS image camera together with fast routines for position extraction and calibration, is experimentally demonstrated. Further, a simulation of the complete sensor system setup is made, and possible sources of error are analyzed experimentally. Our analysis indicates the theoretical...
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