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In order to meet the demands for the high-density, high-performance, high-speed, smaller form factor and multi-function integration in portable electronic products, novel packaging technology now trends toward system in package (SiP) technology. 3D packaging technology is one of the most optimum means to achieve SiP. The embedded technology is one of the 3D packaging solutions and playing a key role...
Future applications of flexible displays and wearable electronics will need 3-D stacked flexible interconnects. The interconnection of an ultrathin chip-on-flex (UTCOF) that can provide flexibility is one approach that meets this requirement. Therefore, thermally induced warpage of UTCOF interconnects using anisotropic conductive adhesive (ACA) is investigated. In this paper, the effects of the ACA...
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