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System in Package(SiP) includes technologies of Multi-chip Module(MCM), Multi-chip Package(MCP), stacked die, Package on Package(PoP), Package in Package(PiP) and Embedded substrate. While Au wire bonding technology is commonly used as current SIP interconnection solution, take Staked Die structure for example, with increasing stack die number the upper die needs longer wire bonding length for signal...
For the trend of electronic consumer product, more functionalities, high performance, miniaturization, high reliability and low cost have been demanded intensely, especially in the rapid growth of portable cell phone domain. Furthermore, multiple functional demand induces advanced package developments, such as system-on-chip (SoC) and System-in-Package (SiP). System-on-chip (SoC) is an ideal package...
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