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The interface of epoxy molding compound (EMC) and Cu is known to be one of the weakest points in the electronic package design. Self-assembly monolayer (SAM) has been suggested as adhesion promoter of EMC-Cu system. Due to the length scale issues, traditional finite element or Molecular dynamic simulation can not individually simulate the behavior of the EMC-SAM-Cu interface in electronic packages...
In this paper, the fine pitch ball grid array (FBGA) assembly with lead free solder was tested under thermal cycling condition. Finite element modeling and simulation was conducted. The microstructure designs of via in pad of substrate and through hole (via) in PCB under the solder joint were simulated. The solder mask definition (SMD) and non-solder mask definition (NSMD) on PCB board side was also...
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