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Eine robuste Oberfläche zwischen Molekülen und Elektroden ist wichtig für die Konstruktion von molekularen und elektronischen Bauelementen. In ihrem Forschungsartikel auf S. 20680 demonstrieren Y. Tian et al., dass die Au‐C≡C‐Bindung unter Thiol‐ reichen Bedingungen hoch stabil ist und bessere elektrochemische Eigenschaften als Au‐S‐ und Au‐Se‐Bindungen zeigt. Basierend auf den bemerkenswerten Eigenschaften...
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