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Epoxy based polymers are widely used in the semiconductorindustry as thermal or/and electrical interfaces and as encapsulating material. In the automotive industry epoxy molding compounds are often used to protect not only singleIC packages but also the entire electronic control units (ECUs) or power modules. Fracture processes in mold materials used for the encapsulation of electro mechanical components...
An approach for statistical and reliability analyses of concrete structures is presented. It describes the virtual simulation used on the way from assessment of experimental results to reliability analysis. The whole approach is based on randomization of nonlinear fracture mechanics finite element analysis of concrete structures. Efficient techniques of both nonlinear numerical analysis of concrete...
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