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The effect of thinning down the chip thickness, will affect the stress pattern in the chip and causes the chip to deform locally when the thickness of the chip is thinner than a certain critical value. Such a local deformation may cause sharp gradient of residual stress around the solder bumps and thus, various failures. This paper shows that by considering the effect of solder bumps on a 50 mum chip,...
Measurement and modeling for the stress on the active area of the die embedded in an organic resin system has been studied. Embedded structure was successfully realized by doing a sequential lamination process using no other materials but conventional build-up materials, used in printed circuit board, in the organic substrate except die. Embedding process consists of lamination process, laser drilling...
Miniaturisation of electronic devices and the RoHS directive have made the use of solder joints challenging. Thus, new methods for attachment of chips have been developed, such as adhesive attachments. Moisture is the principal cause for failures in these attachments. The effects of moisture to non-conductive adhesive attachments were studied by modeling with finite element method and by environmental...
A numerical modelling method for the analysis of solder joint damage and crack propagation has been described in this paper. The method is based on the disturbed state concept. Under cyclic thermal-mechanical loading conditions, the level of damage that occurs in solder joints is assumed to be a simple monotonic scalar function of the accumulated equivalent plastic strain. The increase of damage leads...
With the demanding of market, the electronic portable products can be characterized by increasing signal frequencies and higher density of functions. The electronic products are expected to be produced smaller and smaller. There is one way to meet the requirement, which is a three- dimensional integration of components. A new concept of a packaging structure is proposed based on an embedded chip structure...
This paper considers mechanical stress and strain in a piezoresistive cantilever sensor under surface stress loading, which is the loading condition that occurs in biochemical sensing applications. Finite element simulations examine the piezoresistor sensitivity due to changes in cantilever length, width, and thickness, and piezoresistor size, location, and depth. A few unexpected results are found...
Since mechanical stress sometimes degrades both electronic functions and reliability of LSI chips, it is very important to control the residual stress in them to assure their highly reliable performance. The authors have already found that the local residual stress distribution on the transistor formation surface of LSIs changes significantly depending on their assembly structure. In addition, we...
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